ELECTRONIC MATERIALS
ELECTRONIC MATERIALS
The electronic materials field is booming due to factors including the expansion of teleworking, the spread of 5G, and the progress of digitalization to create a smart society. Our company’s strength lies in our possession of distinctive chemical materials and components, including proprietary products such as low dielectric materials such as acid anhydrides using liquid-phase air oxidation and quinone-based photo-sensitizer ANTHRACURETM, and the SK Resin of thermocuring phenolic resins offered in a wide range of grades as semiconductor sealing material curing agents. We constantly strive to innovate these materials and components to meet our customers’ material development needs.
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SK Resin
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Photo-sensitizer, ANTHRACURE™ UVS
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Liquid-phase air oxidation equipment
Polyimide monomer
Polyimide is used in microelectronics due to its superior heat and resistance, electrical insulation, and mechanical strength.
We have a range of polyimide raw materials that provide various effects including low CTE, transparency and low dielectric.
| Product name | CAS No. | Structural formula / Chemical formula | Application | SDS |
|---|---|---|---|---|
| p-phenylenebis (trimellitate anhydride) | 2770-49-2 |  |
Polyimide monomer (dianhydride) Expected effects: Low CTE, low water absorbency |
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| 2,2-bis (4-hydroxyphenyl) propane-benzoate- 3,3',4,4'-tetracarboxylic dianhydride | 2770-50-5 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of transparency, solvent solubility |
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| 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] hexafluoropropane dianhydride | 61778-79-8 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of low dielectric, adhesiveness, toughness, low water absorbency |
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| 1,4-Bis (3,4-dicarboxyphenoxy) benzene dianhydride | 17828-53-4 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of adhesiveness, toughness |
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| Spiro [fluorene-9,9'-xanthene] -2',3',6',7'-tetracarboxylic dianhydride | 167887-55-0 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of transparency, low CTE, low water absorbency, solvent solubility |
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SK Resin thermocuring resin
View detailsSK Resin is thermocuring resin for semiconductor sealing materials with the added-value of phenolic compounds.
In addition to high heat resistance, water resistance, chemical resistance, abrasion resistance, and excellent molding processability that surpasses polyimide, it also has excellent handling properties and is characterized by its high versatility for a wide range of applications.
We offer phenolic curing agents for epoxy resins in a wide range of grades according to the application.
| Product name | CAS No. | Grade / ICI melting viscosity(150℃) ×102mPa･s | Application | SDS |
|---|---|---|---|---|
| SK Resin HE100C series | 26834-02-6 |
HE100C-10 0.7〜1.1 HE100C-15 1.8〜2.2 HE100C-30 2.7〜4.1 |
Characteristics: Standard phenolic aralkyl resin with superior low viscosity and low water absorbency Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE200C series | 205830-20-2 |
HE200C-07 0.4〜0.9 HE200C-10 0.9〜1.2 |
Characteristics: Standard biphenyl aralkyl resin with superior high flame resistance and low water absorbency Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE500C series | 82148-19-4 | HE510-05 0.5〜0.9 | Characteristics: Ultra-low viscosity and superior low water absorption for applications with high filler content Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE600C series | 894786-56-2 | HE610C-07 0.6〜1.1 | Characteristics: Superior high flame resistance, low elasticity, low water absorbency, and low viscosity for environmental applications Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE900C series | 304859-44-7 |
HE910-10 0.9〜1.3 HE910-20 1.6〜2.1 |
Characteristics: Superior high Tg, low viscosity, high reactivity and low warpage for applications for high heat resistance Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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Functional chemical products
We have a wide range of functional raw materials (compounds with structures that exhibit heat resistance, have a high refractive ratio, etc.) used in organic synthetic intermediates.
| Product name | CAS No. | Structural formula / Chemical formula | Application | SDS |
|---|---|---|---|---|
| 1-Naphthaldehyde | 66-77-3 |  |
Organic synthetic intermediates | ー |
| 2,3-Dihydroxynapthtalene | 92-44-4 |  |
Organic synthetic intermediates | ー |
| 1-Naphtoic acid | 86-55-5 |  |
Organic synthetic intermediates | ー |
| 2-Napthtoic acid | 93-09-4 |  |
Organic synthetic intermediates | ー |
| 2,6-Naphthalenedicarboxylic acid | 1141-38-4 |  |
Organic synthetic intermediates | ー |
| 4-Biphenylcarboxylic acid | 92-92-2 |  |
Organic synthetic intermediates | ー |
| 2,3-Pyridinedicarboxylic acid | 89-00-9 |  |
Organic synthetic intermediates | ー |
| Quinaldic acid | 93-10-7 |  |
Organic synthetic intermediates | ー |
| 3,4-Dihydroxybenzaldehyde | 139-85-5 |  |
Organic synthetic intermediates | ー |
| 4,4'-Dicarboxydiphenyl ether | 2215-89-6 |  |
Organic synthetic intermediates | ー |
| Anthracene-9-carboxylic acid | 723-62-6 |  |
Organic synthetic intermediates | ー |
| 9-Fluorenone | 486-25-9 |  |
Organic synthetic intermediates | ー |
Photo-sensitizer, ANTHRACURE™ UVS
Our proprietary photo-sensitizer ANTHRACURE™ series increase curing (or hardening) rate and improve properties of cured products by absorbing longer-wavelength UV radiation for which photopolymerization initiators are not sufficiently sensitive.
| Brand | Product name | UV absorption [nm] | Applications | SDS |
|---|---|---|---|---|
| ANTHRACURE™ |
UVS-1331 | 365, 385, 405 | Inks (indirect food contact inks, Flexo inks)
Inkjet Inks Coatings (Clear coatings, Release Paper, Film coatings) Additive Manufacturing (AM) (3D printing inks) Photo resist Sealants, Adhesives |
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| UVS-1101 | 365, 385, 405 | |||
| UVS-581 | 355, 375, 395 | |||
| UVS-2171 | 300 - 340 |
Quinone derivatives
Quinone derivatives made from naphthoquinone are polycyclic aromatic functional materials with naphthalene and anthracene structures. They have unique characteristics including oxidation-reduction, bioactivity, flame and heat resistance, light absorbency and radical supplementation.
| Product name | CAS No. | Structural formula / Chemical formula | Application | SDS |
|---|---|---|---|---|
| 1,4-Dihydroxynaphthalene | 571-60-8 |  |
Functional resin raw materials |  |
| Quino Power™ | ー | Undisclosed | Polymerization inhibitor (water-soluble, scale prevention) | ー |