PRODUCT
PRODUCT
SK Resin thermocuring resin
SK Resin is thermocuring resin (curing agent) for semiconductor sealing materials with the added-value of phenolic compounds manufactured in-house.
These curing agents, which have ultra-high heat resistance and superior molding and curing properties, are available in both the “flame-retardant free” type, where the resin itself has flame-resistance, and the “halogen-free flame-resistant” type.
An abundant variety of grades are available to suit a wide range of needs, especially for the high-end class (highest quality).
Special grade curing agents for epoxy resins
We offer phenolic curing agents for epoxy resins in a wide range of grades for all applications.
| Grade | CAS No. | Application |
|---|---|---|
| SK Resin HE100C series | 26834-02-6 | Standard phenolic aralkyl resin with superior low viscosity and low water absorbency |
| SK Resin HE200C series | 205830-20-2 | Standard biphenyl aralkyl resin with superior high flame resistance and low water absorbency |
| SK Resin HE500C series | 82148-19-4 | Ultra-low viscosity and superior low water absorption for applications with high filler content |
| SK Resin HE600C series | 894786-56-2 | Superior high flame resistance, low elasticity, low water absorbency, and low viscosity for environmental applications |
| SK Resin HE900C series | 304859-44-7 | Superior high Tg, low viscosity, high reactivity and low warpage for applications for high heat resistance |
General heat-resistant grade
The QH Series is a heat-resistant base resin that can be used in a diversity of applications.
It displays heat resistance and abrasion resistance far exceeding those of conventional phenolic resins.
| Product name | Application |
|---|---|
| QH Series | Sliding material applications, a wide range of applications due to superior abrasion resistance |
Main features
- High heat resistance, water resistance, chemical resistance, and abrasion resistance surpassing that of polyimide
- Superior molding processability that improves work efficiency and cuts manufacturing costs
- Superior handling and high versatility supporting a wide range of applications
Main applications
Semiconductor sealant, semiconductor interlayer insulators, photoresist for semiconductor circuit formation, flexible prints, polyimide film for substrates, resin for printed circuit boards, color filters for LCDs