ELECTRONIC MATERIALS/PHARM & AGRIC CHEMICALS
ELECTRONIC MATERIALS/PHARM & AGRIC CHEMICALS
The electronic materials field is booming due to factors that include the advances being made in high-speed communications and digitalization directed toward the creation of a smart society. Our company’s strength lies in our possession of distinctive chemical materials and components, such as low dielectric materials, including acid anhydrides using liquid-phase air oxidation, and SK Resin, a thermocuring phenolic resin offered in a wide range of grades as a semiconductor sealing material curing agent. We constantly strive to innovate these materials and components to meet our customers’ material development needs.
In the pharmaceutical chemical and agrichemical fields, we propose high-yield processes for pharmaceutical raw materials and pharmaceutical and agrichemical intermediates by contract manufacturing. Utilizing the Air Water Group's multi-purpose plants and one plant certified under the Good Manufacturing Practices (GMP) system, we provide high-quality products under a comprehensive quality assurance system.
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SK Resin
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Liquid-phase air oxidation equipment
Polyimide monomer (Dianhydrides)
These materials are used as polyimide monomers that contribute to achieving properties required in the microelectronics field, such as heat resistance, chemical resistance, electrical insulation, and mechanical strength.
We offer a wide range of polyimide raw materials with expected benefits such as low CTE (low coefficient of thermal expansion), transparency and low dielectric properties, in addtion to the products listed below. This allows us to propose the most suitable materials tailored to each application.
| Product name | CAS RN® | Structural formula / Chemical formula | Application |
|---|---|---|---|
| TMBPA 2,2-bis (4-hydroxyphenyl) propane-benzoate- 3,3',4,4'-tetracarboxylic dianhydride |
2770-50-5 |  |
Polyimide monomer (Dianhydride) Expected benefits: Low dielectric loss, Solvent solubility,Thermoplasticity, Transparency |
| TMNHQ [4-(1,3-dioxo-2-benzofuran-5-carbonyl)oxynaphthalen-1-yl] 1,3-dioxo-2-benzofuran-5-carboxylate |
203644-89-7 |  |
Polyimide monomer (Dianhydride) Expected benefits: High heat resistance, Low CTE,High mechanical strength, Low water absorption, Low dielectric loss tangent |
| TMHQ p-phenylenebis (trimellitate anhydride) |
2770-49-2 |  |
Polyimide monomer (Dianhydride) Expected benefits: Low CTE, Low water absorption, Low dielectric loss tangent |
| SFDA Spiro [fluorene-9,9'-xanthene] -2',3',6',7'-tetracarboxylic dianhydride |
167887-55-0 |  |
Polyimide monomer (Dianhydride) Expected benefits: Solvent solubility, Low CTE, Transparency, Heat resistance |
SK Resin thermocuring resin
View detailsSK Resin is thermocuring resin for semiconductor sealing materials with the added-value of phenolic compounds.
In addition to high heat resistance, water resistance, chemical resistance, abrasion resistance, and excellent molding processability that surpasses polyimide, it also has excellent handling properties and is characterized by its high versatility for a wide range of applications.
We offer phenolic curing agents for epoxy resins in a wide range of grades according to the application.
| Product name | CAS RN® | Grade / ICI melting viscosity(150℃) ×102mPa･s | Application | SDS |
|---|---|---|---|---|
| SK Resin HE100C series | 26834-02-6 |
HE100C-10 0.7〜1.1 HE100C-15 1.8〜2.2 HE100C-30 2.7〜4.1 |
Characteristics: Standard phenolic aralkyl resin with superior low viscosity and low water absorbency Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE200C series | 205830-20-2 |
HE200C-07 0.4〜0.9 HE200C-10 0.9〜1.2 |
Characteristics: Standard biphenyl aralkyl resin with superior high flame resistance and low water absorbency Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE500C series | 82148-19-4 | HE510-05 0.5〜0.9 | Characteristics: Ultra-low viscosity and superior low water absorption for applications with high filler content Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE600C series | 894786-56-2 | HE610C-07 0.6〜1.1 | Characteristics: Superior high flame resistance, low elasticity, low water absorbency, and low viscosity for environmental applications Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE900C series | 304859-44-7 |
HE910-10 0.9〜1.3 HE910-20 1.6〜2.1 |
Characteristics: Superior high Tg, low viscosity, high reactivity and low warpage for applications for high heat resistance Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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Functional chemical products
We have a wide range of functional raw materials (compounds with structures that exhibit heat resistance, have a high refractive ratio, etc.) used in organic synthetic intermediates.
| Product name | CAS RN® | Structural formula / Chemical formula | Application | SDS |
|---|---|---|---|---|
| 1-Naphthaldehyde | 66-77-3 |  |
Organic synthetic intermediates | ー |
| 2,3-Dihydroxynaphthalene | 92-44-4 |  |
Organic synthetic intermediates | ー |
| 1-Naphthoic acid | 86-55-5 |  |
Organic synthetic intermediates | ー |
| 2-Naphthoic acid | 93-09-4 |  |
Organic synthetic intermediates | ー |
| 2,6-Naphthalenedicarboxylic acid | 1141-38-4 |  |
Organic synthetic intermediates | ー |
| 4-Biphenylcarboxylic acid | 92-92-2 |  |
Organic synthetic intermediates | ー |
| 2,3-Pyridinedicarboxylic acid | 89-00-9 |  |
Organic synthetic intermediates | ー |
| Quinaldic acid | 93-10-7 |  |
Organic synthetic intermediates | ー |
| 3,4-Dihydroxybenzaldehyde | 139-85-5 |  |
Organic synthetic intermediates | ー |
| 4,4'-Dicarboxydiphenyl ether | 2215-89-6 |  |
Organic synthetic intermediates | ー |
| Anthracene-9-carboxylic acid | 723-62-6 |  |
Organic synthetic intermediates | ー |
| 9-Fluorenone | 486-25-9 |  |
Organic synthetic intermediates | ー |
Contract manufacturing of pharmaceutical and agricultural chemicals raw materials and intermediates
Contract manufacturing of fine chemicals including raw materials for pharmaceuticals and raw materials for agrochemicals
Affiliate company SUNCHEMICAL Co., Ltd. handles contract manufacturing of fine chemical products including pharmaceutical raw materials and pharmaceutical intermediates. Since its founding in 1970, it has amassed a diversity of production experience, and uses its technology and expertise to promptly respond to customer needs.
It has a multi-purpose plant of roughly 50 reaction vessels and a GMP plant dedicated to active pharmaceutical ingredients, providing high quality products, under a comprehensive quality assurance system.
Furthermore, thanks to extensive experience in handling heterocyclic compounds, advanced technological capabilities and a stable supply system, it can meet the development needs of agrochemical manufacturers in Japan and worldwide for a diversity of derivatives.