ELECTRONIC MATERIALS/PHARM & AGRIC CHEMICALS
ELECTRONIC MATERIALS/PHARM & AGRIC CHEMICALS
The electronic materials field is booming due to factors that include the advances being made in high-speed communications and digitalization directed toward the creation of a smart society. Our company’s strength lies in our possession of distinctive chemical materials and components, such as low dielectric materials, including acid anhydrides using liquid-phase air oxidation, and SK Resin, a thermocuring phenolic resin offered in a wide range of grades as a semiconductor sealing material curing agent. We constantly strive to innovate these materials and components to meet our customers’ material development needs.
In the pharmaceutical chemical and agrichemical fields, we propose high-yield processes for pharmaceutical raw materials and pharmaceutical and agrichemical intermediates by contract manufacturing. Utilizing the Air Water Group's multi-purpose plants and one plant certified under the Good Manufacturing Practices (GMP) system, we provide high-quality products under a comprehensive quality assurance system.
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SK Resin
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Liquid-phase air oxidation equipment
Polyimide monomer
Polyimide is used in microelectronics due to its superior heat and resistance, electrical insulation, and mechanical strength.
We have a range of polyimide raw materials that provide various effects including low CTE, transparency and low dielectric.
| Product name | CAS No. | Structural formula / Chemical formula | Application | SDS |
|---|---|---|---|---|
| p-phenylenebis (trimellitate anhydride) | 2770-49-2 |  |
Polyimide monomer (dianhydride) Expected effects: Low CTE, low water absorbency |
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| 2,2-bis (4-hydroxyphenyl) propane-benzoate- 3,3',4,4'-tetracarboxylic dianhydride | 2770-50-5 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of transparency, solvent solubility |
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| 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] hexafluoropropane dianhydride | 61778-79-8 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of low dielectric, adhesiveness, toughness, low water absorbency |
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| 1,4-Bis (3,4-dicarboxyphenoxy) benzene dianhydride | 17828-53-4 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of adhesiveness, toughness |
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| Spiro [fluorene-9,9'-xanthene] -2',3',6',7'-tetracarboxylic dianhydride | 167887-55-0 |  |
Polyimide monomer (dianhydride) Expected effects: Impartation of transparency, low CTE, low water absorbency, solvent solubility |
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SK Resin thermocuring resin
View detailsSK Resin is thermocuring resin for semiconductor sealing materials with the added-value of phenolic compounds.
In addition to high heat resistance, water resistance, chemical resistance, abrasion resistance, and excellent molding processability that surpasses polyimide, it also has excellent handling properties and is characterized by its high versatility for a wide range of applications.
We offer phenolic curing agents for epoxy resins in a wide range of grades according to the application.
| Product name | CAS No. | Grade / ICI melting viscosity(150℃) ×102mPa･s | Application | SDS |
|---|---|---|---|---|
| SK Resin HE100C series | 26834-02-6 |
HE100C-10 0.7〜1.1 HE100C-15 1.8〜2.2 HE100C-30 2.7〜4.1 |
Characteristics: Standard phenolic aralkyl resin with superior low viscosity and low water absorbency Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE200C series | 205830-20-2 |
HE200C-07 0.4〜0.9 HE200C-10 0.9〜1.2 |
Characteristics: Standard biphenyl aralkyl resin with superior high flame resistance and low water absorbency Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE500C series | 82148-19-4 | HE510-05 0.5〜0.9 | Characteristics: Ultra-low viscosity and superior low water absorption for applications with high filler content Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE600C series | 894786-56-2 | HE610C-07 0.6〜1.1 | Characteristics: Superior high flame resistance, low elasticity, low water absorbency, and low viscosity for environmental applications Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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| SK Resin HE900C series | 304859-44-7 |
HE910-10 0.9〜1.3 HE910-20 1.6〜2.1 |
Characteristics: Superior high Tg, low viscosity, high reactivity and low warpage for applications for high heat resistance Application: Curing agents for epoxy resins Sealing material, laminate substrate, etc. |
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Functional chemical products
We have a wide range of functional raw materials (compounds with structures that exhibit heat resistance, have a high refractive ratio, etc.) used in organic synthetic intermediates.
| Product name | CAS No. | Structural formula / Chemical formula | Application | SDS |
|---|---|---|---|---|
| 1-Naphthaldehyde | 66-77-3 |  |
Organic synthetic intermediates | ー |
| 2,3-Dihydroxynapthtalene | 92-44-4 |  |
Organic synthetic intermediates | ー |
| 1-Naphtoic acid | 86-55-5 |  |
Organic synthetic intermediates | ー |
| 2-Napthtoic acid | 93-09-4 |  |
Organic synthetic intermediates | ー |
| 2,6-Naphthalenedicarboxylic acid | 1141-38-4 |  |
Organic synthetic intermediates | ー |
| 4-Biphenylcarboxylic acid | 92-92-2 |  |
Organic synthetic intermediates | ー |
| 2,3-Pyridinedicarboxylic acid | 89-00-9 |  |
Organic synthetic intermediates | ー |
| Quinaldic acid | 93-10-7 |  |
Organic synthetic intermediates | ー |
| 3,4-Dihydroxybenzaldehyde | 139-85-5 |  |
Organic synthetic intermediates | ー |
| 4,4'-Dicarboxydiphenyl ether | 2215-89-6 |  |
Organic synthetic intermediates | ー |
| Anthracene-9-carboxylic acid | 723-62-6 |  |
Organic synthetic intermediates | ー |
| 9-Fluorenone | 486-25-9 |  |
Organic synthetic intermediates | ー |
Contract manufacturing of pharmaceutical and agricultural chemicals raw materials and intermediates
Contract manufacturing of fine chemicals including raw materials for pharmaceuticals and raw materials for agrochemicals
Affiliate company SUNCHEMICAL Co., Ltd. handles contract manufacturing of fine chemical products including pharmaceutical raw materials and pharmaceutical intermediates. Since its founding in 1970, it has amassed a diversity of production experience, and uses its technology and expertise to promptly respond to customer needs.
It has a multi-purpose plant of roughly 50 reaction vessels and a GMP plant dedicated to active pharmaceutical ingredients, providing high quality products, under a comprehensive quality assurance system.
Furthermore, thanks to extensive experience in handling heterocyclic compounds, advanced technological capabilities and a stable supply system, it can meet the development needs of agrochemical manufacturers in Japan and worldwide for a diversity of derivatives.